Vacuum desoldering pump golden

Vacuum desoldering pump (solder suction) is designed to remove solder during the assembly of electronic components.

Represents the vacuum pump with a tip for a retraction of the melted solder from the processed surface. The vacuum pump is implemented in the form of a spring-loaded piston with a lock of its position in the cocked position, with the tip of the inlet channel in the form of a constriction.

The principle of operation of a vacuum desoldering pump (solder suction): the solder is melted at the place of soldering, the cocked suction is brought, the release button of the latch is pressed, the spring pushes the piston, the pressure drop sucks the solder inward, freeing the parts on the board.

All metal structures of the vacuum desoldering pump (solder suction) are ideal for intensive use, including in the production of rework and repair.

The tool can be easily disassembled for quick cleaning.

The vacuum desoldering pump ensures easy and safe dismantling of connections, printed circuit boards and components.